By B. Guenther, M. Maier, J. Koeble, A. Bettac (auth.), Christian Joachim (eds.)
This quantity files the 1st overseas Workshop on Atomic Scale Interconnection Machines organised by means of the eu built-in venture AtMol in June 2011 in Singapore. The 4 classes, mentioned right here in revised contributions by way of excessive point audio system, span the topics of multi-probe UHV instrumentation, atomic scale nano-material nanowires characterization, atomic scale floor conductance measurements, floor atomic scale mechanical machineries. This cutting-edge account brings educational researchers and engineers entry to the instruments they should be on the vanguard of the atomic scale know-how revolution.
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Additional info for Atomic Scale Interconnection Machines: Proceedings of the 1st AtMol European Workshop Singapore 28th-29th June 2011
This microscope determines the minimum length of metallic surface wiring that must be fabricated starting from the nano-pads (B) in Fig. 1 toward the next contact stage based on metallic microcantilevers. Fortunately, with a large surface gap, the surface area of those interconnects can be expanded laterally without significant leakage currents between the different electrodes. This is the basic of the UHV interconnection machine described in this chapter where a low temperature approach is not compulsory.
1007/978-3-642-28172-3_4, Ó Springer-Verlag Berlin Heidelberg 2012 35 36 D. Martrou et al. Fig. 1 Scheme of the atomic scale interconnection machines for wide surface band gap substrates. A The atomic scale circuitry embedded into the surface, B contacting metallic nanopads, C nanowires, D microelectrodes, E metallic microcantilevers electron beam will charge the surface. In this case, an optical microscope must be used. This microscope determines the minimum length of metallic surface wiring that must be fabricated starting from the nano-pads (B) in Fig.
Two to four probes can be used to perform both surface conductance measurements  and mechanical manipulations of the nanoobjects . Some of the molecules or molecular structures are only stable on the surface at liquid helium temperatures. Therefore, the possibility of transfer at low temperatures is essential for conserving the built structures. The transfer mechanism between the LT-STM and the multiprobe chambers was designed to be cooled to liquid helium temperature (Fig. 1). Additional differential pumping of the cold transfer mechanism ensures clean transfer of the sample from the LT-STM to the multiprobe side.